$200 Billion Deal: Samsung Becomes Key AI Chip Supplier for Broadcom Through 2030
Samsung locks in a $200 billion multi-year deal with Broadcom for AI chips, HBM memory & foundry through 2030—boosting its race against TSMC.
Samsung locks in a $200 billion multi-year deal with Broadcom for AI chips, HBM memory & foundry through 2030—boosting its race against TSMC.
Bank of America calls Meta’s custom AI chip progress and faster, cheaper 14GW infrastructure buildout a “big positive.” Iris production starts September 2026.
The largest investment under Apple’s American Manufacturing Program.
The new multi-year agreement covers custom ASIC silicon and wireless components.
Anthropic has started developing a custom AI chip and is in early talks with Samsung. The news sparked a sell-off in Nvidia, AMD, and semiconductor stocks amid growing custom silicon trend.
At Investor Day 2026, Qualcomm announced Dragonfly C1000 for AI workloads, major Meta partnership, Microsoft collaboration, and sharply raised long-term targets.