Amkor and NVIDIA Commit $3 Billion to Expand AI Packaging Capacity in South Korea and Arizona
Amkor targets over 300% more advanced packaging capacity by 2028 under expanded NVIDIA partnership for next-generation AI platforms.
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NVIDIA Backs Amkor with $1.5B to Expand Advanced Packaging for Next-Gen AI
NVIDIA funds Arizona expansion to boost U.S. AI infrastructure capacity.
TSMC Delays $410 Million ASML Machines Until 2029 to Cut Costs
TSMC will postpone using ASML’s most advanced high-NA EUV lithography machines until 2029 to cut costs. A13 chips entering production and new Arizona packaging plant also announced.