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GlobalFoundries and TSMC Agree on $2 Billion Plan for U.S. Silicon Interposers for AI Packaging

GFS will make silicon interposers for TSMC’s CoWoS packaging in Malta, N.Y., under a multi-year $2B deal, with volume ramp in early 2028.

GlobalFoundries and TSMC Agree on $2 Billion Plan for U.S. Silicon Interposers for AI Packaging
Credit: GlobalFoundries
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